Copos

CoPoS is a next-generation chip packaging technology being developed by TSMC to meet the escalating demands of artificial intelligence hardware systems.

Chip packaging—the critical manufacturing stage where finished chips are physically assembled, interconnected, and prepared for deployment—has become as strategically important as silicon design itself in determining AI system performance and reliability. The shift toward advanced packaging architectures reflects the fundamental limits of traditional approaches in handling the power density and thermal requirements of modern AI processors.

TSMC is accelerating its CoPoS development timeline, targeting production readiness by 2028, with Nvidia's next-generation AI processor, codenamed Feynman, apparently serving as a key driver of these accelerated schedules. As AI chips become increasingly complex and power-intensive, technologies like CoPoS represent a critical evolution in how the semiconductor industry approaches processor assembly and system integration.